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	Electroplating/Sputtering system
	Principle of Sputtering： Primarily on the use of glow discharging Argo ion collision target surface, the target atom was activated and left on the substrate film. Sputtered Films nature and uniform than the evaporation, deposition rate much slower than. New sputtering equipment used almost all of the electronic powerful magnet into a spiral movement around the target to accelerate the argon ion. Target caused argon ion and the impact probability, increasing sputtering rate. Most of general metal coating by DC sputtering and not conductive ceramics materials using RF sputtering exchange. The basic principle is used in a vacuum glow discharge Argon ion impact target surface, the plasma cation will be accelerated dashed as sputtering material negative electrode surface. This impact will fly out of the target material and the deposition on the substrate to form thin films. Application of Sputtering： EMI vacuum sputtering with high conductivity and high efficiency electromagnetic shielding characteristics, widely used in communications products (mobile phones), computers (notebook), the portable electronic products , Network hardware (servers etc.), medical equipment, household electronic products and aerospace and defense electronic equipment EMI shielding. Applicable to the various plastic products in metal shielding (PC, PC+ABS, ABS, etc.)

	Vacuum electrosplating	Vacuum electrosplating	Vacuum Magnetic Sputtering Coating Machine	Vacuum machine

	Wheel Sputtering System	Wheel Sputtering System	Compressor oil merge system	Compressor electrophoresis coating system

	Compressor electrophoresis coating equipments	Electrical parts water electrosplating system	UV paint spraying sytem	Vacuum Electroplating Coating System(Lamp Shade)

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